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PS-IE-1767
closed - The proposer decided not to go ahead
2007-09-17 08:49
2007-09-17 08:49
This PS has been Quality labeled
ICT Call 2 (FP7-ICT-2007-2)
3 Components, systems, engineering
3.5 Photonic components and subsystems
STREP
One Step Proposal
09/10/2007
Ireland
This PS has been Quality labeled

PROPOSAL AT A GLANCE

Proposal name:
Generation 3 Camera - Gen3Cam
Subject:

The purpose of this project is the development of a 3rd generation imager concept , where CCD may be considered as Generation1 and CMOS imagers being Generation 2) based on high performance image sensors. This project addresses Objective 3.5 (Photonic components and subsystems) in Challenge 3 (Components, systems, engineering) of ICT Call 2, and more specifically, it addresses Target Outcome a), part (5) which is directed at "sensors exploiting innovative sensing principles".

We would like to introduce the DigitalAPD Imager concept. It is a silicon (visible) imager based on our well established photon counting photodiode detector technology. The imager consists of arrays of pixels, each pixel being a photodiode biased above the breakdown, i.e. operating in Geiger mode. This mode of operation distinguishes the DigitalAPD from all other state of the art imager concepts (CCD & CMOS) and, in our view, constitutes a 3rd Generation Imager concept. It is a truly digital imager as each photon creates a digital signal which is counted at the pixel level, i.e. the data read out from each pixel each frame is a digital number representing the number of photons detected.

The DigitalAPD technology is based on CMOS compatible design and processing resulting in the possibility of manufacturing the detector in any CMOS foundry. Additionally, it is possible to add any digital functionality on the same silicon as the detector.


PROJECT DESCRIPTION

Proposal Outline:

This project will research and develop the next generation imager camera based on the “Digital APD Imager” concept. This will be a silicon based imager consisting of arrays of pixels, each pixel being a photodiode biased above the breakdown, i.e. operating in Geiger mode and will also contain integrated timer/counter circuitry. This mode of operation distinguishes the DigitalAPD from all other state of the art imager concepts (CCD & CMOS). The core of the pixel is always the Geiger mode photon counting silicon photodiode. The electronics that are incorporated into each pixel depend on the application that the technology is seeking to address. This could be counting for low level digital imaging or timing for high resolution timing focal plane arrays or a combination of the two for the highest degree of functionality. The Geiger mode operation means that a single photon causes an avalanche breakdown leading to the generation of a pulse of current. Integrated reset or quench electronics resets the pixel within a few ns – resulting in the generation of a digital pulse within the pixel for each photon detected.

The successful completion of the project will result in a cost effective imager with added functionality above the current state of the art imagers. It will also help European industry to remain at the forefront in high value photonic systems. Such an imaging system will have impact over a broad range of sectors, including health, well-being, security, environment and communications. It will ensure continued European leadership in photonics RTD at the compnent and systems level, securing the necessary human resources and know-how to design, produce and use a new generation of photonic components.

We would like to assemble a consortium to work on developing the above system which has a wide ramge of potential applications. While we posess some of the core technology developed, we require partners to help move the device forward under this call.

Keywords:
Low Light Imaging
Photon Counting
Photon Timing
LIDAR
Night vision
Security imaging
Range finding
Wide dynamic range imaging
Single photon imaging

PARTNER PROFILE SOUGHT

Required skills and Expertise:

We require partners with expertise in the following areas:

Systems design

Optics & Optical design

ASIC / ROIC design

Wafer back thinning

Through hole / through wafer via technology

Micro lens / microlens technology

Packaging

Microscope manufacturer

Description of work to be carried out by the partner(s) sought:
We require partners with exterise in any of the above areas to assist in an R&D project based on the Gen3 Digital APD imager
Type of partner(s) sought:

SME

University

Research Institute

Foundry

The Proposer is looking for a Coordinator:
Yes

PROPOSER INFORMATION

Organisation:
SensL
Department:
SensL
Type of Organisation:
Industry - SME
Country:
Ireland
                       
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